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Cadence培訓(xùn)高級(jí)班將首先讓您了解CB板上出現(xiàn)的信號(hào)反射、串?dāng)_、電源/地平面干擾、時(shí)序匹配以及電磁兼容性等一系列問(wèn)題產(chǎn)生的機(jī)理，并掌握其解決方法；然后講解并上機(jī)練習(xí)Cadence的高速 PCB設(shè)計(jì)與仿真工具SPECCTRAQuest的使用。使您在硬件設(shè)計(jì)過(guò)程中，能夠達(dá)到“設(shè)計(jì)即正確”的目的。

        在工作實(shí)踐中遇到了高速數(shù)字電路與高速PCB設(shè)計(jì)問(wèn)題；對(duì)高速PCB設(shè)計(jì)感興趣的硬件工程師；已經(jīng)具備一定的硬件開(kāi)發(fā)經(jīng)驗(yàn)，需要增加就業(yè)競(jìng)爭(zhēng)力的在校碩士及博士研究生；具備非常扎實(shí)的電子工程基本知識(shí)，并積累了相當(dāng)程度的硬件工程師工作經(jīng)驗(yàn)的在校本科生。

        堅(jiān)持小班授課，為保證培訓(xùn)效果，增加互動(dòng)環(huán)節(jié)，每期人數(shù)限3到5人。注意：本課程一旦開(kāi)課不予退費(fèi)。

        1、培訓(xùn)過(guò)程中，如有部分內(nèi)容理解不透或消化不好，可免費(fèi)在以后培訓(xùn)班中重聽(tīng)；
        2、課程完成后,授課老師留給學(xué)員手機(jī)和Email,保障培訓(xùn)效果,免費(fèi)提供半年的技術(shù)支持。
        3、培訓(xùn)合格學(xué)員可享受免費(fèi)推薦就業(yè)機(jī)會(huì)。

◆【黃老師】

有15年的FPGA和DSP系統(tǒng)硬件開(kāi)發(fā)經(jīng)驗(yàn),8年視頻和圖像處理領(lǐng)域的高速DSP系統(tǒng)硬、軟件和FPGA系統(tǒng)的設(shè)計(jì)和開(kāi)發(fā)經(jīng)驗(yàn)，高速系統(tǒng)設(shè)計(jì)經(jīng)驗(yàn)非常豐富，精通Allegro cadence和candence SPECCTRAQuest等信號(hào)完整性仿真，精通高速PCB SI仿真工具以及PADS,Altium Designer等PCB設(shè)計(jì)工具。
      
★更多師資力量請(qǐng)見(jiàn)曙海師資團(tuán)隊(duì)。

第一階段

1 高速PCB設(shè)計(jì)中的理論基礎(chǔ)
    傳輸線(xiàn)理論、信號(hào)完整性（反射、串?dāng)_、過(guò)沖、地彈、振鈴等）、電磁兼容性和時(shí)序匹配等等。
2 SPECCTRAQuest設(shè)計(jì)流程
    2.1 Pre-Placement
    2.2 Board Setup Requirements for Extracting and Applying Topologies
    2.3 Database Setup Advisor
        —Cross-Section
        —DC Nets
        —DC Voltages
        —Device Setup . ??—SI Models
        —SI Audit

3 拓?fù)浣Y(jié)構(gòu)的抽取與仿真 Extracting and Simulating Topologies
    3.1 Pre-Route Extraction Setup—Default Model Selection.
    3.2 Pre-Route Extraction Setup—Unrouted Interconnect
    3.3 Pre-Route Template Extraction
    3.4 SQ Signal Explorer Expert
    3.5 Analysis Preferences
    3.6 SigWave
    3.7 Delay Measurements

第二階段

4 確定和施加約束 Determining and Adding ConstraintsSolution
    4.1 Solution SpaceAnalysis: Step 1 to 6
    4.2 Parametric Sweeps.
    4.3 Constraints :
        Topology Template Constraints
        Switch/Settle Constraints
        Assigning the Prop Delay Constraints
        Impedance Constraint
        Relative Propagation Delay Constraint
        Diff Pair Constraints
        Max Parallel Constraint
        Wiring Constraint
        User-Defined Constraint
        Signal Integrity Constraints
    4.4 Usage of Constraints Defined in Topology Template

5 模板應(yīng)用和基于約束的布局
    Template Applications and Constraint-Driven Placement
    5.1 Creating a Topology
    5.2 Wiring the Topology
    5.3 TLines and Trace Models
    5.4 Coupled Traces
    5.5 RLGC Matrix of Coupled Trace Models
    5.6 Crosstalk Simulation in SQ Signal Explorer Expert
    5.7 Simulating with Coupled-Trace Models
    5.8 Sweep Simulation Results with Coupled-Trace Models
    5.9 Extracting a Topology Using the Constraint Manager
    5.10 Electrical Constraint Set
    5.11 Applying Electrical CSet
    5.12 Worksheet Analysis
    5.13 Spacing and Physical Rule Sets
    5.14 Electrical Rule Set

第三階段

6 基于約束的布線(xiàn) Constraint-Driven Routing
    6.1 Manual Routing
    6.2 Routing with the SPECCTRA Smart Route
    6.3 Driving Constraints in Routing
7 布線(xiàn)后的DRC檢查和分析 Post-Route DRC and Analysis
    7.1 Post-Route Analysis
    7.2 SigNoise
    7.3 Reflection Simulation
    7.4 Reflection Waveform Analysis
    7.5 Comprehensive Simulation
    7.6 Crosstalk Simulation
    7.7 Crosstalk Analysis
    7.8 Simultaneous Switching Noise Simulation
    7.9 SSN Waveform Analysis
    7.10 System-Level Analysis
    7.11 A Complete Design Link
    7.12 Initialize Design Link

8 差分信號(hào)設(shè)計(jì) Differential Pair Design Exploration
    8.1 Types of Differential Pairs in SPECCTRAQuest
    8.2 Create Differential Pair Using SPECCTRAQuest
    8.3 Create Differential Pair Using Constraint Manager
    8.4 Assigning Differential Pair Signal Models
    8.5 Preference to Extract Unrouted Differential Pair Topology
    8.6 Extracting Unrouted Differential Pair Topology
    8.7 Custom Stimulus to Analyze Differential Pair Topology
    8.8 Differential Pair Topology Analysis
    8.9 Coupled Trace Model and Differential Pair Topology
    8.10 Layout Cross-section Editor
    8.11 Differential Pair Constraints
    8.12 Differential Pair Constraints in the Constraint Manager
    8.13 Differential Pair Analysis in the Constraint Manager
    8.14 Post Route Extraction

9 時(shí)序仿真和和PI仿真
9.1 時(shí)序仿真
9.2 PI仿真

10. 多板仿真和Design Link模型
10.1 Design Link模型的創(chuàng)建和修改
10.2 主板和子板，底板和核心板的接口信息的查找和顯示
10.3 多板仿真建模
10.4 多板仿真主板和子板資源添加和接口連接
10.5 網(wǎng)絡(luò)列表創(chuàng)建
10.6 仿真參數(shù)設(shè)置
10.7 探測(cè)仿真

11. SI仿真環(huán)境的建立和時(shí)序仿真－－DDR3和Flash,高速數(shù)據(jù)線(xiàn)的時(shí)序控制
11.1 SI仿真模型的查找技巧和IBIS格式轉(zhuǎn)換
11.2 仿真環(huán)境的設(shè)置和仿真模型分配和審核
11.3 DDR3和Flash,高速數(shù)據(jù)線(xiàn)時(shí)序仿真在項(xiàng)目開(kāi)發(fā)中作用和意義
11.4 時(shí)序控制的公式推導(dǎo)和理論基礎(chǔ)
11.5 對(duì)應(yīng) Setup Time和 Hold Time 公式的深入理解
11.6 公式參數(shù)在芯片datasheet中的查找
11.7 時(shí)序仿真的高速數(shù)據(jù)線(xiàn)等網(wǎng)絡(luò)組的創(chuàng)建和拓?fù)涮崛?br> 11.8 時(shí)序仿真的激勵(lì)
11.9 時(shí)序仿真類(lèi)型
11.10 時(shí)序仿真結(jié)果查看
11.11 時(shí)序仿真的約束
11.12 SigXplore和Constraint Manager
11.13 設(shè)計(jì)規(guī)則應(yīng)用和規(guī)則驅(qū)動(dòng)布局